PN Type Package Designator Pb-Free Packages - Manufacturing Conversion Datecode, Refer to Note 1 Type of Plating / Finish Matte Tin Annealing Process Minimum Plating Thickness Does this Microchip Pb-free device meet RoHS compliance for the following 6 materials: Pb, Hg, Cr6+, Cd, and PBB / PBDE Total Mass (g) STANDARD5L SC70 0508Matte Tin150C / 1hr w/l 24 hours400 microinchesYes0.0062
MCP9701T-E/LT |
RFQ for MCP9701T-E/LT |
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| Technical/Catalog Information | MCP9701T-E/LT |
| Vendor | Microchip Technology (VA) |
| Category | Sensors, Transducers |
| Voltage - Supply | 3.1 V ~ 5.5 V |
| Package / Case | SC-70-5 |
| Packaging | Cut Tape (CT) |
| Output Type | Voltage |
| Sensing Temperature | -40°C ~ 125°C |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | MCP9701T E LT MCP9701TELT MCP9701T E LTCT ND MCP9701TELTCTND MCP9701T-E/LTCT |
| Product | Manufacturers | Pack | D/C | ||||||||
| MCP9701T-E/LT | - | - | - |